Advanced Vacuum
For Chip Manufacturing
Ebara Technologies’ next-generation lineup delivers a broad range of pumping speeds and process capabilities, supporting applications from clean, light-duty environments to the most demanding harsh processes. Designed for today’s semiconductor manufacturing needs, EBARA’s pumps are engineered for energy-efficient operation, compact footprints with advanced materials for ultimate durability in powdery, corrosive, and high-throughput applications.
Model EV-S
Process Capability clean to light duty
Performance & Efficiency most energy efficient
Design & Technology smallest footprint
The EV-S Series covers a wide pumping speed range from 58cfm exceeding 706cfm. EV-S dry (oil free) vacuum pumps are robust, compact, lightweight, energy efficient and designed for clean to light duty applications.
Model EV-X
Process Capability multi-process capable
Performance & Efficiency 10,000 – 30,000 l/min
Design & Technology compact footprint
The EV-X Series offers our latest dry pump technology designed for medium to harsh duty processes, equipped with Ebara’s unique energy-saving technology. Its modular design with wide-range temperature control, optimized for wafer fab manufacturing, delivers high energy efficiency in a compact footprint.
Model EV-M
Process Capability harsh duty
Performance & Efficiency high temperature, maximum torque
Design & Technology EUV compatible
The EV-M Series covers a wide pumping speed range from 63 cfm exceeding 2825 cfm. The EV-M dry (oil free) vacuum pumps are designed featuring unique temperature control and on demand torque operation necessary for harsh duty process applications.
Model EST
Process Capability harsh duty
Performance & Efficiency robust performance for powder processes
Design & Technology dual-stage screw
The EST Series covers a wide pumping speed range from 360 CFM to 1,765 CFM. EST dry (oil free) vacuum pumps are designed as stand-alone screw pumps constructed of NiResist, a solid cast material known for its superior corrosion resistance, best suited for harsh, powdery and corrosive applications.
Model ESA
Process Capability hydrogen pumping / MOCVD
Performance & Efficiency high throughput performance
Design & Technology multi-stage roots
The ESA Series is designed for high capacity and light gas applications, offering pumping speeds from 88 CFM to 1765 CFM while delivering one of the lowest costs of ownership on the market. Optional NiResist provides superior corrosion resistance for long-term reliability.
Model ESR
Process Capability medium duty
Performance & Efficiency energy-saving
Design & Technology multi-stage roots
The ESR Series covers a wide pumping speed range from 45 CFM exceeding 1,625 CFM. The ESR Series (Energy Saving Roots) are multi-stage dry (oil free) vacuum pumps engineered for applications such as etch and implant.
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