Advanced Bevel Polishing Systems
Ebara Technologies’ bevel polishing systems removes defects and unneeded membranes by polishing the bevels on the edge of semiconductor wafers as well as the top edge and backside edge. Fixed abrasive allows for physical polishing without selection of polish target. Recipe-controllable polishing heads also enable high-precision control of the wafer edge shape.
Model EAC300bi-hv
The EAC300BI-HV bevel polishing system delivers high-throughput, contamination-free fixed abrasive polishing with precise bevel profile control and wide coverage from the top edge to backside for advanced film removal and damage treatment applications.
Model EAC300bi-hp
The EAC300BI-HP bevel polishing system removes defects and unwanted material by polishing the wafer bevel and top edge, using fixed abrasive technology and recipe-controlled polishing heads to enable precise, high-accuracy edge shaping.
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