Advanced CMP Systems for Semiconductor Manufacturing
EBARA Technologies’ CMP systems deliver high-performance planarization for advanced semiconductor manufacturing, supporting processes such as copper, oxide, tungsten, and STI across multiple technology nodes. The lineup includes the 300mm F-REX300XA and F-REX300X platforms, along with the 200mm F-REX200M2, all featuring dual-module architectures, dry in/dry out operation, and flexible configurations for high productivity, process stability, and improved yield.
Model F-REX300XA
The F-REX300XA is a next-generation 300mm CMP system featuring a dual-module design, advanced transport mechanism, and flexible configuration to deliver higher throughput, improved yield, and reduced power consumption for sustainable semiconductor manufacturing.
Model F-REX300X
The F-REX300X is a high-performance 300mm CMP system with a dual-module architecture, multi-step chemical cleaning, and flexible configurations, enabling high throughput, continuous operation, and reliable process performance for both production and development.
Model F-REX200M2
The F-REX200M2 is a versatile 200mm CMP system designed for high process performance and throughput, featuring a dual-module system and flexible configurations to support both mass production and R&D applications.
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