Advanced Plating Systems
EBARA Technologies’ plating systems provide high-speed, high-uniformity electroplating for a wide range of semiconductor and advanced packaging processes. Leveraging proven paddle technology and extensive process expertise, these systems support flexible configurations for multiple applications while ensuring consistent performance, scalability, and yield improvement.
Model UFP600AS
The UFP600AS is a cleanroom-compatible electroplating system that utilizes EBARA’s high-speed paddle technology to deliver superior uniformity and high-speed deposition for advanced panel-level packaging processes including bump, pillar, rewiring, and through via applications.
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